Chipbond Technology Corp.
Industry Group: Semiconductors
Country/Region: Taiwan
Identifier: ROCO:6147
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.
ESG Risk Rating
Ranking
Industry Group (1st = lowest risk)
Semiconductors 170 out of 366
Universe
Global Universe 7665 out of 15104
What are the ESG Risk Ratings?
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Industry Comparison
| Company | ESG Risk Rating | Industry Rank |
|---|---|---|
| Siltronic AG |
21.8
Medium
|
98 out of 366 |
| Chipbond Technology Corp. |
25.3
Medium
|
170 out of 366 |
| Dosilicon Co., Ltd. |
40.6
Severe
|
346 out of 366 |
| BOE HC SemiTek Corp. |
40.9
Severe
|
349 out of 366 |
| Shanghai Fullhan Microelectronics Co., Ltd. |
41.6
Severe
|
354 out of 366 |
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Exposure
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Management
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